Lead free solder. Its excellent wettability, solder-freeing performance, and reliability provide improved workability.
[Features] · Solder paste. · [Eco Solder paste]. · "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder. · [S70G series]. · Maintains the viscosity stability of the GRN364 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production. · Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve. · Types which can improve thermostability and maintain temperature are also available. · [374FS series]. · Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc. · [TVA series]. · A lead-free solder paste developed for usage in 3D implementation such as POP. · [DSR series]. · A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications. · As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.) · [345F series]. · Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.
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