Lead Free Solder Sn99.3% / Cu+Ni0.7% (Part Numbers)

Volume Discount

Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%

[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.

Part Number

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HS-374

Part Numbers

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Part Number
HS-374

Part Number	Standard Unit Price	Minimum order quantity	Volume Discount	Standard Shipping Days ?	RoHS	Wire diameter (φ/mm)
	27.30 €	1	Available	6 Days	10	1.0

Basic information

Type	Bobbin type M	Lead Free	Corresponds To

This page is Lead Free Solder Sn99.3% / Cu+Ni0.7%, part number HS-374.
You can find the detail information about specifications and dimensions on part number HS-374.

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